Nanofabrication Services
Precision & Reliability
Cutting-edge research demands consistency and resolution. With access to i-line and g-line tools (≈1–2 µm), advanced DUV lithography (≈150–300 nm), and electron beam lithography systems (down to <20 nm), we cover the full spectrum from microscale to true nanoscale features. Combined with controlled thin-film processes and rigorous metrology, we deliver repeatable results you can trust — every run, every wafer.
Collaborative Expertise
We’re more than a service provider — we’re a partner. Our team works closely with you to troubleshoot, refine designs, and adapt processes, ensuring your technology moves forward faster and smarter with every iteration.
Custom Fabrication
Your ideas don’t fit into a template — and neither do we. We adapt every process around your goals, from unconventional materials to unique device geometries, giving you access to fabrication capabilities typically reserved for large foundries and national labs.
Rapid Prototyping
Traditional foundries can take months. We move faster. Our agile workflows and direct access to advanced tools allow us to deliver prototypes and small runs in as little as 2-4 weeks, helping you keep momentum in your R&D.
Equipment
Lithography
ABM Contact Aligner
SUSS MA6-BA6 Contact Aligner
ASML PAS 5500/300C 248nm Stepper
GCA AutoStep 365nm Stepper
Heidelberg DWL2000 Mask Writer
Heidelberg MLA150 Maskless Aligner
​Gamma Automated Coat/Develop System
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Metrology
Stylus Profilometry
Filmetrics Reflectometry (F40, F50, F40-UV)
Filmetrics RS50 4-Point Probe
FleXus Film Stress Measurement
Malvern Nano ZS Zetasizer
Malvern NS300 NanoSight
Metricon 2010/M Prism Coupler
Rame-Hart 500 Goniometer
Rudolph FTM
VCA Optima Contact Angle
Woollam RC2 Ellipsometer
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Dry Etching
AJA Ion Mill
Anatech SCE 100RF Asher
Glenn1000 Asher
Oxford Plasmalab 100 ICP
Oxford PlasmaLab 80+
Oxford PlasmaPro 100-380 (Cobra)
Plasma-Therm Versaline ICP
Plama-Therm Takachi Atomic Layer Etching
Primaxx uEtch Vapor HF
Plasma-Therm RIE (72, 720, 740)
Plasma-Therm ICP (770 x2)
Trion Minilock III ICP
Unaxis SLR 770 ICP
Xactix XeF2 Vapor Etch
Yes EcoClean Asher
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E-Beam Lithography
JEOL JBX-6300FS 100kV EBL System
JEOL JBX-9500FS 100kV EBL System
Nabity Nanometer Pattern Generator System
Imaging
Veeco Icon AFM
Bruker Quantax EDS
Zeiss SEM (Gemini, Supra, Ultra)
Macro Photography Setup (Sony A73)
Nikon L200 Eclipse Microscope
Keyence VHX-7100 Digital Microscope
​Scott IR Microscope​
Zygo Optical Profilometer
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Back End Processing
Wet chemistry benches
Leica Critical Point Dryer
Disco Dicing Saw
PDMS Curing Oven
K&S 4522 Gold Ball Bonder
Dedicated KOH Hood
Logitech Orbis CMP
Microdrill
MVD100
Pico MA FinePlacer Flip Chip Bonder
AG610 RTA x2
Suss SB8e Substrate Bonder
Versalaser
Westbond 7400A Ultrasonic Wire Bonder
Osiris International Affix Temporary Bonder/Debonder
Disco Backgrinder
Plasma Dicing/Singulation
Furnace Processing
Doping (Phosphorus, Boron, POCl3)
Low-Temperature Oxide (LTO)
Polysilicon (N+/P+/Undoped)
Silicon Oxide
Nitride
TEOS
General Annealing
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Thin Film Deposition
AJA Orion Sputtering System (x3)
AJA Quantum Materials Deposition System (x2)
Angstrom E-Beam Evaporator
Arradiance ALD Gemstar-6
CHA Mark 50 EB Evaporator
OEM Endeavor M1
Lesker PVD75
CVC 4500 EB Evaporator (x2)
Electroplating Hoods (Au/Cu/Ni)
Oxford ALD FlexAL
Oxford PlasmaLab System100 PECVD
Plasma-Therm Takachi HDP-CVD
Veeco Savannah ALD
Oxford Plasma Pro ASP ALD
Seki Diamond CVD System
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